1. Kugadzirwa kwemagetsi kwakakwira uye mutengo wakaderera wemagetsi:
masero epamusoro-soro ane tekinoroji yekurongedza, indasitiri inotungamira module yekubuda simba, yakanakisa simba tembiricha coefficient -0.34%/℃.
2. Simba guru rinogona kusvika pa605W +:
iyo module yekubuda simba inogona kusvika kusvika ku605W +.
3. Kuvimbika kwepamusoro:
masero asingaparadzi kucheka + akawanda-busbar / super multi-busbar welding tekinoroji.
Zvinobudirira kudzivirira njodzi ye micro cracks.
Yakavimbika furemu dhizaini.
Sangana nekurodha zvinodiwa zve5400Pa kumberi uye 2400Pa kumashure.
Bata zviri nyore akasiyana application mamiriro.
4. Ultra-low attenuation:
Attenuation ye2% mugore rekutanga, uye attenuation ye0.55% gore negore kubva pa2 kusvika ku30 makore.
Ipa mari yenguva refu uye yakagadzikana yekugadzira magetsi kune vatengi vekupedzisira.
Kushandiswa kweaponti-PID masero uye kurongedza zvinhu, kuderera attenuation.
1. mumvuri asi kwete simba:
Kumusoro nekudzika symmetrical parallel component dhizaini.
Zvinonyatsoita, kusawirirana kwemazuva ano kunokonzerwa nekuzununguka kwevana kunotevera, uye kubuda kwekugadzira magetsi kunowedzerwa kubva pa0 kusvika ku50% 6.
Yese chip: 0 simba kubuda.
Hafu chip: 50% simba rekubuda.
2. High Density Packaging Technology:
Kushandisa advanced high-density packaging tekinoroji.
Yakavimbiswa kuenzana kwakakwana kwekushanda uye kuvimbika.
Kushanda kwemodule kwakawedzera neinopfuura 0.15%.
Kushanda kwezuva nezuva kwekambani yedu kunotora hanya uye mutoro.Vashandi vedu vehunyanzvi vane zvakanakira vatengi vedu mupfungwa.Kambani yedu yakagadzira chikuva chebhizinesi chinobvumira vashandi vedu vehunyanzvi kuti vaone zvinangwa zvavo.Isu tinotenda mukutarisira nhengo dzekambani yedu nekugadzira simba remanzwiro rakanaka, kusimbisa, kugovana mazano, nekuita mabasa ekuvimbika.